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Learner Reviews & Feedback for Advanced Semiconductor Packaging by Arizona State University
18 ratings
About the Course
Throughout this course, you will be introduced to Pathway for Assembly and Packaging technologies for 7-nanometer silicon feature sizes and beyond. The course will present the evolution and impact of packaging on product performance and innovation. Specifically, we highlight how packaging has enabled better products via the use of heterogeneous integration by improving the interconnects for thermal management and signal integrity.
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1 - 4 of 4 Reviews for Advanced Semiconductor Packaging
By Basil E
•Feb 6, 2024
This course provides a great overview and Roadmap for Heterogeneous Integration and Advanced packaging. A great starting point for anyone who wants to explore the world of HI.
By 2023 1
•Mar 10, 2024
Good and Informative Course!
By Ranganath K
•Mar 29, 2024
Very well deliverd and extremely pleased with the contents
By Boyi F
•Nov 15, 2023
I hope this class can provide more detailed introduction of advanced packaging techniques, such CoWoS, EMIB, CPO....